Manuscript Title:

ANALYSIS OF SEM PHOTOMICROGRAPHS FOR DEBONDING PATTERN WITH NANO-COMPOSITES AS AN ORTHODONTIC BONDING ADHESIVE

Author:

SABA KHAN, SANJEEV K. VERMA, SANDHYA MAHESHWARI, SUSHMA DHIMAN

DOI Number:

DOI:10.17605/OSF.IO/2GFDW

Published : 2023-06-23

About the author(s)

1. SABA KHAN - Assistant Professor, Department of Orthodontics and Dentofacial Orthopaedics, Dr. Z.A. Dental College, Aligarh Muslim University, Uttar Pradesh.
2. SANJEEV K. VERMA - Professor and Chairman, Department of Orthodontics and Dentofacial Orthopaedics, Dr. Z.A. Dental College, Aligarh Muslim University, Uttar Pradesh.
3. SANDHYA MAHESHWARI - Professor, Department of Orthodontics and Dentofacial Orthopaedics, Dr. Z.A. Dental College, Aligarh Muslim University, Uttar Pradesh.
4. SUSHMA DHIMAN - Private Practitioner, Hasimara, West Bengal.

Full Text : PDF

Abstract

Objective: To evaluate nanocomposite for use as an orthodontic bonding agent; using shear bond strength measurement and scanning electron microscopy to study debonding pattern. Materials and Methods: Study was performed in-vitro on fifty non-carious extracted healthy premolar teeth. Nano-composite (Filtek™ Z350 XT, 3M, ESPE, St. Paul, MN) was used, Enlight Light Cure Adhesive (SDS, Ormco, CA, USA) was used in the conventional adhesive group. Debonding and shear bond testing was performed using a digital universal testing machine (UTM-G-410B, Shanta Engineering). After debonding, all teeth were examined under a Scanning Electron Microscope. Area of remaining composite on the enamel was measured using the area measurement tool of the free PDF editor Foxit® Reader version 6.1.1.1031. Results: The mean SBS of conventional adhesive was found to be significantly higher in the conventional adhesive group. Percent remnant adhesive was also higher in the conventional adhesive group. Conclusion: Nanocomposite can be potentially used as an orthodontic bonding agent.


Keywords

ANALYSIS OF SEM PHOTOMICROGRAPHS FOR DEBONDING PATTERN WITH NANO-COMPOSITES AS AN ORTHODONTIC BONDING ADHESIVE